data sheet lhrf3333/s46-pf/tbs-x ligitek electronics co.,ltd. property of ligitek only doc. no : qw0905- rev. : date : tape and box type led lamps 25 - jun. - 2007 lhrf3333/s46-pf/tbs-x a pb lead-free parts
- + + - ligitek electronics co.,ltd. property of ligitek only package dimensions lhrf3333/s46-pf note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. f p1 p 1.5max 25.0min 1.0min 2.54typ 0.5 typ 8.6 7.6 5.9 5.0 t h p2 h2 w2 w1 w0 l h1 d w3 part no. lhrf3333/s46-pf/tbs-xpage1/6
t opr operating temperature -40 ~ +85 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) red material part no lhrf3333/s46-pf/tbs-x algainp storage temperature spectral halfwidth nm forward voltage @20ma(v) viewing angle 2 1/2 (deg) luminous intensity @20ma(mcd) dominant wave length dnm water clear emittedlens 630202.4 max. 1.5 min. 900 min. 30 1500 typ. -40 ~ +100 color tstg absolute maximum ratings at ta=25 electrostatic discharge( * ) forward current reverse current @5v peak forward current duty 1/10@10khz power dissipation parameter page 2/6 2000 ratings i f esd ir pd i fp symbol ma 30 10 75 90 a v ma mw hrf unit ligitek electronics co.,ltd. property of ligitek only static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * lhrf3333/s46-pf/tbs-x part no.
ligitek electronics co.,ltd. property of ligitek only 4.2 mm maximum 0.17 inch 2.0 22.5 18.5 25.0 23.5 20.9 26.5 0.98 1.04 0.82 0.93 0.73 0.89 0.08 3.00.12 inch 0.15 mm 3.8 minimum d ------- symbol ------- 0.85 0.69 ------- 21.5 17.5 0.89 0.94 0.78 22.5 24.0 19.9 25.51.0 h ------- h1 2.3 f ------- 0.09 specifications symbol items dimension symbol information ? component lead pitch feed hole to bottom of component front-to-rear deflection tape feed hole diameter tbs-7 tbs-3 tbs-6 tbs-5 tbs-1 tbs-2 option code 19.4 22.0 20.0 11 36 19.0 21.5 0.75 1.42 0.43 0.76 0.85 0.87 0.79 5.8 1.42 7.7 9.75 15.5 4.0 19 0.38 0.75 0.16 0.61 0.23 0.3 0.06 130.51 0.75 0.83 0.72 19.0 21.0 18.4 0.71 ------- 18.0 ------- w0 20.50.81 l h2 ------- ------- 0.17 ------- 0.2 4.4 ------- 5.1 0.33 0.57 0 0.69 14.5 8.5 0 17.5 p1 t p2 ------- ------- ------- w0 w1 w3 w2 ------- ------- ------- ------- 12.4 ------- p0.49 mm 34013.4 inch maxmum 2.4 60 27510.8 package dimensions ? feed hole location tape width adhesive tape position adhesive tape width feed hole to overall component height lead length after component height overall taped package thickness center of component location lead location feed hole pitch inch 13.0 mm 330 minimum l symbol 1.97 50 h 265 w10.4 quantity/box overall length overall thickness overall width description dimensions symbol information ? 2000pcs specification remark:tbs=tape and box straight leads tbs-13 tbs-10 tbs-12 tbs-11 tbs-9 24.5 tbs-80.9625.51.0 page 3/6 lhrf3333/s46-pf/tbs-x part no.
r e l a t i v e i n t e n s i t y @ 2 0 m a 600 wavelength (nm) 550 0 700 650 0.5 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 20 ambient temperature( ) fig.5 relative intensity vs. wavelength 1.0 ambient temperature( ) 0.8 -0 -20 -4060 40 2080100 0 -40-20-060 4080100 fig.4 relative intensity vs. temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 fig.3 forward voltage vs. temperature 1.2 3.0 100 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a f o r w a r d c u r r e n t ( m a ) forward current(ma) forward voltage(v) 1.5 1.0 0.1 2.5 2.03.01.010 0 1.0 10 0.5 1.0 1.5 2.0 1001000 fig.2 relative intensity vs. forward current fig.1 forward current vs. forward voltage 1000 3.5 2.5 typical electro-optical characteristics curve ligitek electronics co.,ltd. property of ligitek only 3.0 hrf chip page4/6 30 0 -30 60 100% 25%75% 50% 75%50%0 25% 100% -60 fig.6 directivity radiation lhrf3333/s46-pf/tbs-x part no.
5 /sec max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 0 0 50 preheat 25 120 2 /sec max time(sec) 100 150 260 c3sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 260 temp( c) ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile page 5/6 60 seconds max lhrf3333/s46-pf/tbs-x part no.
jis c 7021: b-12 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. low temperature storage test the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.t.sol=230 5 2.dwell time=5 1sec solderability test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles thermal shock test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs high temperature high humidity test mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 ligitek electronics co.,ltd. property of ligitek only description the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. test condition test item 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test reliability test: reference standard mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 page 6/6 lhrf3333/s46-pf/tbs-x part no.
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